cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 1/6 HBC114YS5 cystek product specification dual npn digital transistors HBC114YS5 features ?built-in bias resistors enable the co nfiguration of an inverter circu it without connecting external input resistors (see equi valent circuit). ?the bias resistors consist of thin-f ilm resistors with complete isolati on to allow negative biasing of the input. they also have the advantage of almost completely eliminating parasitic effects. ? only the on/off conditions need to be set for operation, making device design easy. ? two dtc114y chips in a sot-353 package. ? mounting by sot-323 automatic mounting machines is possible. ?mounting cost and area can be cut in half. ? complements the hba114ys5 ?pb-free package. equivalent circuit outline sot-353 HBC114YS5 tr1 tr2 r b 1=10k , r b 2=10 k r be 1=47k , r be 2=47 k
cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 2/6 HBC114YS5 cystek product specification absolute maximum ratings (each transistor, ta=25 ) parameter symbol limits unit supply voltage v cc 50 v input voltage v in -6~+40 v i o 70 ma output current i o(max.) 100 ma power dissipation pd 200 (note) mw junction temperature tj 150 c storage temperature tstg -55~+150 c note: 150mw per element must not be exceeded. electrical characteristics (each transistor, ta=25 ) parameter symbol min. typ. max. unit test conditions v i(off) - - 0.3 v v cc =5v, i o =100 a input voltage v i(on) 3 - - v v o =0.3v, i o =1ma output voltage v o(on) - 0.1 0.3 v i o /i i =5ma/0.25ma input current i i - - 0.88 ma v i =5v output current i o(off) - - 0.5 a v cc =50v, v i =0v dc current gain g i 68 - - - v o =5v, i o =5ma input resistance r 1 7 10 13 k - resistance ratio r 2 /r 1 3.7 4.7 5.7 - - transition frequency f t - 250 - mhz v ce =10v, i c =5ma, f =100mhz * * transition frequency of the device ordering information device package shipping marking HBC114YS5 sot-353 (pb-free) 3000 pcs / tape & reel g5
cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 3/6 HBC114YS5 cystek product specification characteristic curves dc current gain vs output current 10 100 1000 1 10 100 output current ---io(ma) current gain--- hfe vo=5v output voltage vs output current 10 100 1000 1 10 100 output current ---io(ma) output voltage---vo(on)(mv) io/ii=20 input voltage vs output current (on characteristics) 0.1 1 10 0.1 1 10 100 output current --- io(ma) input voltage --- vi(on)(v) vo=0.3v output current vs input voltage (off characteristics) 0.1 1 10 100 0.1 1 10 input voltage --- vi(off)(v) output current --- io(ma) vcc=5v power derating curves 0 50 100 150 200 250 0 50 100 150 200 ambient temperature---ta() power dissipation---(mw) dual s ingle
cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 4/6 HBC114YS5 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 5/6 HBC114YS5 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c355s5 issued date : 2011.11.16 revised date : page no. : 6/6 HBC114YS5 cystek product specification sot-353 dimension *:typical millimeters marking: 5-lead sot-353 plastic surface mounted package cystek package code: s5 style: pin 1. base1 (b1) pin 2. emitter1 (e1)/emitter 2(e2) pin 3. base2 (b2) pin 4. collector2 (c2) pin 5. collector1 (c1) g5 device code xx date code inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 0.900 1.100 0.035 0.043 e1 2.150 2.450 0.085 0.096 a1 0.000 0.100 0.000 0.004 e 0.650* 0.026* a2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055 b 0.150 0.350 0.006 0.014 l 0.525 ref 0.021 ref c 0.080 0.150 0.003 0.006 l1 0.260 0.460 0.010 0.018 d 2.000 2.200 0.079 0.087 0 8 0 8 e 1.150 1.350 0.045 0.053 notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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